The EX-1543 Cyanate Ester film adhesive has been formulated for use in specific applications where low moisture absorption and /or low dielectric constant/low loss are of the utmost importance. Furthermore, the preceding benefits do not come at the expense of adhesion properties. The resin system’s strength and toughness when bonding solid, honeycomb or foam core structures are comparable and often greater than high performance epoxy adhesives, especially at elevated temperatures.
Due to the cyanate ester resin system’s inherently low shrinkage during cure, bonded structures will retain less inherent stress and will therefore remain dimensionally stable during thermal cycling. This factor is of extreme importance when bonding structures for use in space. Finally, like other cyanate ester based products, the EX-1543 film adhesive displays low outgassing and microcracking properties to assure structural integrity even after severe environmental exposure.
- Cyanate ester film adhesive with low shrinkage, low moisture absorption and low outgassing.
- Low dielectric strength and loss tangent
- Compatible with cyanate ester prepregs such as the BTCy-1 and BTCy-1A series
||207°C/405°F w post cure
|Initial cure temp
||2 hours at 177°C/350°F