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P2Si DS77
Polyimide

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Product description

P2SI® DS77 is a 500-550°F (260-288°C) service temperature structural adhesive with a versatile cure temperature range of 620°F (327°C) to 700°F (371°C). P2SI® DS77 is well suited for bonding wide areas. It is also compatible with PMR-15, Avimid R, RP46, and Avimid RB, as it can be fully cured at lower temperatures than P2SI® DS6N

Product benefits/features
  • Compatible with PMR-15, Avimid R, RP46 and Avimid RB
  • Available in paste or film form from P2Si
  • 260-288C/500-550F capable
Market segments
  • High Temperature
Product type Film Adhesive
Resin type Polyimide
Tg 327-371°C/620-700°F
Cure time Call for details.
Outtime TBD
Post curable Yes
Vacuum processable No
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