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TenCate TCF4045

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Product description

TCF4045 low dielectric low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties.

Product benefits/features
  • Good high temperature properties • Lightweight core fill • Good dielectric properties
  • Lightweight syntactic film core fill with density of 35.5 pcf (0.56 g/cc)
  • Good dielectric properties
Market segments
  • Aerostructures
  • Radome
  • Space/Satellite
Product type Syntactic
Resin type Epoxy
Tg 180°C/356°F
Initial cure temp 179°C/355°F
Cure time 3 hours at 179°C/355°F
Outtime 14 days
Post curable No
Vacuum processable No
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Carbon II