The EX-1516 cyanate ester film adhesive has been formulated to use in specific applications where low moisture absorption and/or low dielectric constant/low loss are of utmost importance.
The resin system’s strength and toughness when bonding solid, honeycomb or foam core structures are comparable and often greater than high performance epoxy adhesives. Due to the cyanate ester resin system’s inherent low shrinkage during cure, bonded structures will retain less inherent stress and will therefore remain dimensionally stable during thermal cycling. This factor is of extreme importance when bonding structures for use in space. Finally, like other cyanate ester-based products, the EX-1516 film adhesive displays low outgassing and microcracking properties to assure structural integrity even after severe environmental exposure and radiation bombardment
- Compatible with EX-1515 prepregs
- Excellent dielectric properties
- Low outgassing
- 121°C/250°F curing, postcurable for higher Tg
|Initial cure temp
||6 hours at 121°C/250°F