P2SI® 700LM is the most thermally stable resin transfer molding (RTM) system available on the market today. P2SI® 700LM has a glass transition temperature in excess of 700°F (371°C) without a post cure,
does not microcrack after standard RTM processing, provides excellent mechanical performance, dielectric properties, durability and processability. With a long pot life, P2SI® 700LM’s robust processing window allows amenability to a variety of component shapes, sizes and production environments. P2SI® 700LM exhibits better thermo-oxidative stability than PMR-15 (and most other PMR-type prepreg systems in the industry) and has the added advantage of being RTM processable, providing the potential for significant reductions in production costs for many components. With a dry service temperature in excess of 600°F, it is one of the most versatile materials available in the industry.
- Thermally stable RTM polyimide resin system
- Robust processing window
- High Tg without need for post cure
|Initial cure temp
||See data sheet for details