Space and satellite

items

Widely used in spacecraft and satellites, TenCate's advanced composites deliver unsurpassed reliability and performance.  With an extensive spaceflight heritage, almost every space program in the Western world utilizes TenCate materials. The harsh rigors of space combined with the absolute need for reliability demand composites that can withstand repeated exposure to temperature extremes and radiation. TenCate materials pass strict NASA and European standards for outgassing and moisture resistance while resisting microcracking. With decades of successful missions, TenCate materials can help your program reach new heights.

With an industry-leading selection of ultra-high modulus fibers and specialty weaves, these spaceflight approved advanced composites create the strongest and lightest weight structures possible. Used on:

  • bus structure,A2100_Sattelite_Snagit_02
  • solar panels,
  • reflectors, heat shields, and 
  • a variety of booms, tubes, and trusses.

TenCate has a full suite of compatible:

  • cyanate ester and epoxy prepregs, 
  • resins, 
  • syntactics and
  • film adhesives. 

TenCate’s line of cyanate ester prepregs provides the highest performance, while our epoxy products meet the rigors of space flight while providing a more cost-effective alternative to cyanate ester materials.

TenCate provides composite materials for the space and satellite market from our Morgan Hill and Fairfield CA  facilities. We serve the European space and satellite market from our Langley Mill, UK manufacturing center of excellence. 

Carbon Fibers Used in Satellite Structure

Satellite Structure Carbon Fibers Modulus Product Form

Toray M55J

Toray M60J

78 MSI/538 GPa

85 MSI/586 GPa

6k PAN

6k PAN

Mitsubishi K13D2U 135 MSI/526 GPa 2k Pitch
NGF YSH50-A 76 MSI/524 GPa 1k,3k, 6k Pitch

Featured product

RS-36
TenCate RS-36 is an advanced modified epoxy system for structural composite applications such as satellites and related satellite structure. RS-36 offers an excellent balance of mechanical properties, low moisture absorption, high glass transition temperatures and a range of processing options. A slightly higher Tg version is available, called RS-36-1, with similar mechanical properties.

Space and Satellite Featured

Featured application

Space and satellite Featured case

Resources

  • Product TableProduct Table
    Product Name Resin Type Tg Cure Temp Description SDS
    Thermoset prepregs
    BTCy-1A Cyanate Ester 185°C/365°F or 207°C/405°F with post cure 120 minutes at 177°C/350°F. Optional post cure of 60 minutes at 204°C/400°F Excellent structural properties with low moisture absorption and good resistance to galvanic corrosion

    Toughened version of BTCy-1
    Request_TCAC_MSDS
    EX-1515 Cyanate Ester 121°C/249°F or 174°C/345°F with post cure 180 min at 121°C/250°F. Optional post cure of 2 hrs at 177°C/350°F for final Tg Optimal mechanicals, low microcracking, high radiation resistance and low moisture absorption. High level of cure at 121°C/250°F

    High Tg from post cure at 177°C/350°F
    Request_TCAC_MSDS
    EX-1522 Epoxy 180°C/356°F 120 minutes at 177°C/350°F Low moisture absorption

    Toughened prepreg system with good high temperature properties

    Excellent mechanical properties
    Request_TCAC_MSDS
    RS-3 & RS-3C Cyanate Ester 191°C/375°F or 254°C/490°F with post cure 120 minutes at 177°C/350°F. Optional post cure of 60 minutes at 232°C/450°F Good balance of toughness and high temperature performance with good modulus retention after radiation exposure

    Features RS-3C, a controlled flow version for vacuum bag/oven cure, and RS-3M, a very low flow autoclave version
    Request_TCAC_MSDS
    RS-36 Epoxy 181°C/358°F 90 minutes at 177°C/350°F Epoxy with excellent properties, more cost effective solution vs cyanate ester prepregs

    Low moisture absorption
    Request_TCAC_MSDS
    TC275-1 Epoxy 168°C/327°F or 183°C/362°F with post cure 6 hours at 135°C/275°F or 120 minutes at 177°C/350°F Ideal for launch structure, out of autoclave processible

    Low moisture absorption, high strength retention under hot/wet conditioning
    Request_TCAC_MSDS
    TC410 (NEW) Cyanate Ester 112°C/234°F or 181°C/358°F with post cure 3 hours at 121°C/250°F. Optional post cure at 177°C/350°F Low stress free cure temperature capable

    Passes and exceeds space requirements for outgassing

    Low CTE and CME

    Extremely low moisture absorption. Resin is asymptotic after 200 days with less than 0.35% moisture absorption in a 75% RH environment
    Request_TCAC_MSDS
    TC420 (NEW) Cyanate Ester 177°C/350°F or 348°C/658°F with post cure 3 hours at 177°C/350°F. Optional post cure at 260°C/500°F Very high temperature service. Used in heatshields and ablatives

    Good resistance to microcracking

    Out of autoclave processible
    Request_TCAC_MSDS
    Film Adhesives
    EX-1516 Cyanate Ester 126°C/258°F 300 minutes at 121°C/250°F Toughened cyanate ester with low cure temperature

    Features low cure shrinkage

    Low outgassing, good resistance to microcracking and resistance to environmental and radiation exposure
    Request_TCAC_MSDS
    EX-1543 Cyanate Ester 207°C/405°F with post cure 120 minutes at 177°C/350°F Optional post cure of 120 minutes at 204°C/400°F Compatible resin film adhesive with:

    Low cure shrinkage Low moisture absorption Low outgassing and resistance to cyclic microcracking
    Request_TCAC_MSDS
    RS-4A Cyanate Ester 203°C/397°F 120 minutes at 177°C/350°F Low tack version, with low cure shrinkage

    Good balance of toughness and mechanical strength

    Low moisture absorption, low microcracking, reticulatable for lightweight core bonding
    Request_TCAC_MSDS
    RS-15H Epoxy 99°C/211°F 360 minutes at 93°C/200°F Low temperature curing film adhesive Request_TCAC_MSDS
    TC263 Epoxy 110°C/230°F 120 minutes at 121°C/250°F Toughened epoxy film adhesive Request_TCAC_MSDS
    TC310 Epoxy 157°C/315°F 120 minutes at 177°C/350°F Excellent balance of high temperature service and toughness

    Designed for bonding honeycomb/composite structure or composite to composite laminate

    Co curable
    Request_TCAC_MSDS
    TC4015 Cyanate Ester 177°C/350°F, or 321°C/610°F with post cure 120 minutes at 177°C/350°F followed by post cure of >60 minutes at 232°C/450°F Compatible film adhesive for TC420 prepreg

    Excellent high temperature properties

    Low shrinkage during cure to retain dimensional properties of bonded assemblies
    Request_TCAC_MSDS
    Syntactic Adhesives
    EX-1541 Cyanate Ester 177°C/350°F 90-120 minutes at 177°C/350°F One part syntactic paste available in four different densities: 0.18, 0.21, and 0.28 g/cc (11, 13, and 17.5 pcf)

    Low outgassing

    Used as a foam core
    Request_TCAC_MSDS
    EM-5A Cyanate Ester 204°C/400°F 120 minutes at 177°C/350°F Expanding syntactic film/core splice

    Density of 0.80 g/cc (50 pcf) unexpanded 

    Expansion ratio of 4x
    Request_TCAC_MSDS
    SF-5 Cyanate Ester 254°C/490°F 120 minutes at 177°C/350°F. Optional post cure of 120 minutes at 232°C/450°F Syntactic film compatible with cyanate ester prepregs Request_TCAC_MSDS
    TCF4001 Cyanate Ester 177°C/350°F 120 minutes at 177°C/350°F, optional post cure of 60-90 minutes at 232°C/450°F Syntactic paste, ideal for filling core or cavities

    Capable of high temperature service with post cure

    Compatable with TC420 prepreg

    Density of 0.35-0.42 g/cc (22-26 pcf) nominal
    Request_TCAC_MSDS
    TCF4035 Epoxy 140°C/284°F 180 minutes at 130°C/265°F Syntactic film with low dielectric properties

    May be post cured for higher Tg

    Density of 0.64 g/cc (40 pcf) nominal
    Request_TCAC_MSDS
    TCF4045 Epoxy 180°C/356°F 180 minutes at 179°C/355°F Low dielectric syntactic fil

    Density of 35.5 (0.56 g/cc) nominal
    Request_TCAC_MSDS
    TCF4050 Cyanate Ester 177°C/350°F 120 minutes at 177°C/350°F, optional post cure of 60-90 minutes at 232°C/450°F Expanding syntactic film (core splice)

    Compatible with TC420 prepreg

    Capable of high temperature service
    Request_TCAC_MSDS
    RTM Resins
    EX-1510 Cyanate Ester 193°C/380°F or 230°C/447°F with post cure 120 minutes at 177°C/350°F. Optional post cure of 120 minutes at 249°C/480°F Toughened resin system with very low 150 cps viscosity at 25°C/77°F

    Good mechanical properties and thermal properties

    Low moisture absorption

    24 hr pot life
    Request_TCAC_MSDS
    EX-1545 Cyanate Ester 173°C/345°F 90 minutes at 177°C/350°F. Optional post cure at 204°C/400°F Toughened resin system two part system

    Full properties with 177°C/350°F cure

    Low viscosity of 140 cps at 43°C/110°F
    Request_TCAC_MSDS
    RS-16 Cyanate Ester 167°C/332°F or 231°C/448°F with post cure 120 minutes at 135°C/275°F followed by 120 minutes at 150°C/300°F Low cure temperature

    Two part resin system
    Request_TCAC_MSDS

Related products

Product Category Compression Moulded Parts

Product Category Thermoset

Product Category Film Adhesives
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