• 90 minutes at 350°F/177°C Optional post cure of 120 minutes at 450°F/232°C

• Excellent structural properties with low moisture absorption and good resistance to galvanic corrosion

• 120 minutes at 350°F/177°C Optional post cure of 60 minutes at 400°F/204°C

• Improved toughness version of BTCy-1, very low void content even with low pressure cures.

• 90 minutes at 350°F/177°C

• TenCate's lowest dielectric resin.

250°F/121°C

• 120 minutes at 250°F/121°C

• Good dielectric properties with 250°F/121°C cure capability.

• 180 min at 250°F/121°C. Optional post cure 2 hrs at 350°F/177°C for final Tg

• Optimal mechanicals, low microcracking, high radiation resistance and low moisture absorption. High level of cure at 250°F/121°C. High Tg from post cure at 350°F/177°C.

• 120 minutes at 350°F/177°C

• Very low moisture absorption, toughened
• Excellent mechanical properties

• 120 minutes at 350°F/177°C Optional post cure of 60 minutes at 450°F/232°C

• Good balance of toughness and high temperature performance with good modulus retention after radiation exposure.
• RS-3C is a controlled flow version for vacuum bag/oven cure, and RS-3M is a very low flow autoclave version.

• 120 minutes at 380°F/193°C Optional post cure of 240 minutes at 550°F/288°C

• Controlled flow with long out time. Very high temperature properties

• 300 minutes at 265°F/129°C Optional post cure of 95 minutes at 310°F/154°C

• A moderate tack prepreg with low cure shrinkage, ability to cure at 265°F, low moisture absorption, excellent modulus retention after radiation

• 120 minutes at 275°F/135°C Optional post cure of 120 minutes at 325°F/163°C

• Very low moisture absorption with balanced mechanical, toughness and modulus

• 90 minutes at 350 F/177°C

• Epoxy with excellent properties and lower costs than cyanate esters, vacuum processible, and low moisture absorption

• 3 hours at 250°F/121°C
  Optional post cure 350°F/177°C 

• Low stress free cure temperature capable
• Resin is low in moisture sensitivity
• Passes and exceeds space requirements for outgassing
• Low CTE and CME
• Extremely low moisture absorption. Resin is asymptotic after 200 days with less than 0.35% moisture absorption in a 75% RH environment.

• 3 hours at
  350°F/177°C.
  Optional post cure at 500°F/260°C 

• 300 minutes at 250°F/121°C

• Toughened cyanate ester with low cure temperature
• Features low cure shrinkage
• Low outgassing, good resistance to microcracking and resistance to severe environmental and radiation exposure

• 60-90 minutes at 350°F/175°C Optional post cure of 120 minutes at 450°F/232°C

Compatible resin film adhesive with:

• Low cure shrinkage
• Low moisture absorption
• Low outgassing and resistance to cyclic microcracking

• 120 minutes at 350°F/177°C

• Low tack version, with low cure shrinkage
• Good balance of toughness and mechanical strength
• Low moisture absorption, low microcracking, reticulatable for lightweight core bonding

• 300 minutes at 250°F/121°C

• Two part paste adhesive, good mechanical performance. Ideal for cryogenic and space applications.

• 120 minutes at 350°F/177°C

• Thixotropic two part paste adhesive

• 120 minutes at 350°F/177°C

• Low viscosity unfilled version of EX-1537

• 90-120 minutes at 350°F/177°C

• One part syntactic paste available in five different densities: 11, 13, 17.5, 20 and 24 pcf. Ideal to be used as a foam core. Low outgassing.

• 120 minutes at 350°F/177°C Optional post cure of 120 minutes at 450°F/232°C

• Syntactic film compatible with cyanate ester prepregs

• 120 minutes at 350°F/177°C Optional post cure of 120 minutes at 480°F/249°C

• Toughened resin system with very low 150 cps viscosity at 77°F/25°C
• Good mechanical properties and thermal properties
• Low moisture absorption

• 90 minutes at 350°F/177°C Optional post cure at 400°F/204°C

• Toughened resin system, two part system
• Full properties with 350°F/177°C cure
• Low viscosity of 140 cps at 110°F/43°C