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Materials Selection Guide: Space/Satellite

Product Name Resin Type Tg Cure Temp/Cure Time Description MSDS
Prepregs
BTCy-1 Cyanate
Ester
374°F/190°C
or 461°F/238°C with post cure
  • 90 minutes at 350°F/177°C Optional post cure of 120 minutes at 450°F/232°C
  • Excellent structural properties with low moisture absorption and good resistance to galvonic corrosion

BTCy-1A Cyanate
Ester
365°F/185°C or 400°F/204°C with post cure
  • 120 minutes at 350°F/177°C Optional post cure of 60 minutes at 400°F/204°C
  • Improved toughness version of BTCy-1, very low void even with low pressure cures
 
EX-1515 Cyanate
Ester
274°F/134°C or 360°F/182°C with post cure
  • 180 min at 250°F/121°C. Optional post cure of 2 hrs at 350°F/177°C for final Tg
  • Optimal mechanicals, low microcracking, high radiation resistance and low moisture absorption. High level of cure at 250°F/121°C. High Tg from post cure at 350°F/177°C.
 
RS-3 &
RS-3C
Cyanate
Ester
390°F/199°C or 490°F/254°C with post cure
  • 120 minutes at 350°F/177°C Optional post cure of 60 minutes at 450°F/232°C
  • Good balance of toughness and high temperature performance with good modulus retention after radiation exposure
  • Features RS-3C, a controlled flow version for vacuum bag/oven cure, and RS-3M, a very low flow autoclave version
 
RS-9D Cyanate
Ester
390°F/199°C or 700°F/371°C with post cure
  • 120 minutes at 380°F/193°C Optional post cure of 240 minutes at 600°F/315°C
  • Very high temperature properties. Controlled flow with long out time.
 
RS-12B Cyanate
Ester
293°F/190°C or 322°F/161°C with post cure
  • 300 minutes at 265°F/129°C Optional post cure of 95 minutes at 310°F/154°C
  • A low tack prepreg with low cure shrinkage, ability to cure at 265°F, low moisture absorption, excellent modulus retention after radiation.
 
RS-17B Epoxy 314°F/172°C or 390°F/199°C with post cure
  • 120 minutes at 275°F/135°C Optional post cure of 120 minutes at 325°F/163°C
  • Very low moisture absorption with balanced mechanical, toughness and modulus.
 
RS-36 Epoxy 379°F/193°C
  • 90 minutes at 350°F/177°C
  • Epoxy with excellent properties and lower cost than cyanate esters, vacuum processible, and low moisture absorption.
 
TC410 Cyanate Ester 234°F/112°C or 358°F/181°C with post cure
  • 3 hours at
    250°F/121°C.
    Optional post cure at 350°F/177°C 
  • Low stress free cure temperature capable 
  • Resin is low in moisture sensitivity 
  • Passes and exceeds space requirements for outgassing 
  • Low CTE and CME
  • Extremely low moisture absorption. Resin is asymptotic after 200 days with less than 0.35% moisture absorption in a 75% RH environment.
 
TC420 Cyanate Ester 350°F/177°C or 610°F/321°C with post cure
  • 3 hours at
    350°F/177°C.
    Optional post cure at 500°F/260°C 
  • Very high temperature service
    Good resistance to microcracking
    Out of autoclave processible
Film Adhesives
EX-1516 Cyanate
Ester
250°F/121°C
  • 300 minutes at 250°F/121°C
  • Toughened cyanate ester with low cure temperature
  • Features low cure shrinkage
  • Low outgassing, good resistance to microcracking and resistance to severe environmental and radiation exposure
 
EX-1543 Cyanate
Ester
500°F/260°C with post cure
  • 60-90 minutes at 350°F/175°C Optional post cure of 120 minutes at 450°F/232°C
Compatible resin film adhesive with:
  • Low cure shrinkage
  • Low moisture absorption
  • Low outgassing and resistance to cyclic microcracking
 
RS-4A Cyanate
Ester
397°F/203°C
  • 120 minutes at
    350°F/177°C
  • Low tack version, with low cure shrinkage
  • Good balance of toughness and mechanical strength
  • Low moisture absorption, low microcracking, reticulatable for lightweight core bonding
 
TC4015 Cyanate Ester 350°F/177°C
  • 120 minutes at
    350°F/177°C
  • Space structures
  • Ablative bonding
  • High temperature structures

Paste Adhesives
EX-1502-1 Cyanate
Ester
260°F/127°C
  • 300 minutes at 250°F/121°C
  • Two part paste adhesive, good mechanical performance. Ideal for cryogenic and space applications.

 

EX-1537 Cyanate
Ester
405°F/207°C
  • 120 minutes at 350°F/177°C
  • Thixotropic two part paste adhesive
 
EX-1537-1 Cyanate
Ester
405°F/207°C
  • 120 minutes at 350°F/177°C
  • Low viscosity unfilled version of EX-1537
 
Syntactic Adhesives
EX-1541 Cyanate
Ester
350°F/177°C
  • 90-120 minutes at 350°F/177°C
  • One part syntactic paste available in five different densities: 11, 13, 17.5, 20 and 24 pcf. Ideal to be used as a foam core. Low outgassing.
 
SF-5 Cyanate
Ester
349°F/176°C
  • 120 minutes at 350°F/177°C Optional post cure of 120 minutes at 450°F/232°C
  • Syntactic film compatible with cyanate ester prepregs
 
TCF4001 Cyanate Ester
(Syntactic Foam)
350°F/177°C
  • 120 minutes at
    350°F/177°C
    Optional post cure of 
    60-90 minutes at
    450°F/232°C
  • Cyanate ester syntactic foam
  • Packed or injected into tooling cavities and can also be extruded with the proper tooling
 
TCF4050 Cyanate Ester
(Core Splice) 
350°F/177°C
  • 120 minutes at
    350°F/177°C
    Optional post cure of 
    60-90 minutes at
    450°F/232°C
  • Core splice adhesive
  • Tensile strength up to
    500°F/260°C
  • Compatible with TC420 and EX1505 prepreg resin systems
 
RTM Resins
EX-1510 Cyanate
Ester
380°F/193°C or 447°F/230°C with post cure
  • 120 minutes at 350°F/177°C Optional post cure of 120 minutes at 480°F/249°C
  • Toughened resin system with very low 150 cps viscosity at 77°F/25°C
  • Good mechanical properties and thermal properties
  • Low moisture absorption
  • 24 hr pot life 
 
EX-1545 Cyanate
Ester
345°F/173°C
  • 90 minutes at 350°F/177°C Optional post cure at 400°F/204°C
  • Toughened resin system, two part system
  • Full properties with 350°F/177°C cure
  • Low viscosity of 140 cps at 110°F/43°C
 
RS-16 Cyanate
Ester
332°F/167°C
  • 120 minutes at 275°F/135°C followed by 120 minutes at 300°F/150°C
  • Low cure temperature
  • Two part resin system
 
Bulk Molding Compounds
MS-1A Epoxy 327°F/164°C High modulus epoxy Tensile Strength 42 ksi
(290 MPa)
Tensile Modulus - 19 msi 
(131 GPa)
  
MS-1D Epoxy 327°F/164°C High modulus epoxy Tensile Strength 28 ksi
(193 MPa)
Tensile Modulus - 19 msi
(131 GPa)
  
MS-1H Epoxy 327°F/164°C Fast cure intermediate modulus epoxy Tensile Strength 37 ksi
(255 MPa)
Tensile Modulus - 10 msi
(69 GPa)
  
MS-2D Epoxy 327°F/164°C High thermal conductivity Tensile Strength 28 ksi
(193 MPa)
Tensile Modulus - 19 msi
(131 GPa)
MS-4A Epoxy 327°F/164°C Standard modulus epoxy Tensile Strength 45 ksi
(310 MPa)
Tensile Modulus - 9 msi
(62 GPa)
  
MS-4F Cyanate Ester 379°F/193°C Standard modulus cyanate ester Tensile Strength 45 ksi
(310 MPa)
Tensile Modulus - 7 msi
(48 GPa)
MS-4H Epoxy 375°F/193°C Fast cure standard modulus epoxy Tensile Strength 44 ksi
(303 MPa)
Tensile Modulus - 6 msi
(41 GPa)
 
Various Thermoplastic Various Standard or intermediate modulus PPS, PEEK or Nylon 11  
TML: Total Mass Loss, CVCM: Collected Volatile Condensible Materials, CTE: Coefficient of Thermal Expansion, WVR: Water Vapor Regained, CME: Coefficient of Moisture Expansion